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peek Wafer Cassette

PEEK Wafer Cassette

The wafer cassette is used for handling and storage of wafer carrier, the main role is to connect to different production machines' micro-environment box reaction chambers, to prevent wafer particle contamination, to improve handling and storage reliability and transportation efficiency, various sizes of the wafer chip to meet the needs of different areas and different levels of the chip, so wafer box in the existence of different sizes.
The peek Carrier Wafer is suitable for transferring wafers during the manufacturing process, with the wafer clip can store and transport wafers, storage, and transfer reliability.

Applications

Cassette Wafer PEEK

Specifically, PEEK wafer cassette are designed to transport different types of semiconductor wafers, and semiconductor materials of the third generation like silicon, germanium, gallium arsenide, and others.

They function as shields during the processing, movement, and storage of wafers to ensure that the wafers do not come in contact with contaminants when moving and while in storage.

PEEK material performs well on ant-static properties as well as low degassing characteristics this assists in the reduction of particle contaminants hence enhancing the quality of wafers.

Advantages of PEEK Wafer Cassette

Anti-static

PEEK Carrier Wafer can achieve an anti-static level, and the surface resistivity reaches 10⁶-109

Good wear resistance

The process of loading PEEK Carrier Wafer will not produce fine wear debris to contaminate the wafer clip.

Chemical corrosion resistance

PEEK wafer cassette can resist corrosion from various chemicals during wafer cleaning,

Dimensional stability

PEEK Carrier Wafer has high rigidity, which can not only resist deformation caused by external forces but also ensure the packaging accuracy between components.

Low degassing

The amount of gas released at room temperature or even high-temperature environment is minimal, which can meet the high requirements of a wafer cassette for gas cleanliness.

High-temperature resistance

PEEK Carrier Wafer can meet the drying temperature requirements of 150-260 degrees Celsius, and the size of the product will not change.

General Client Question

size Capacity D1 Pitch Slot pitch bottom width
4" 25 14.53mm(0.57") 4.76mm(0.19") 1.52mm(0.06")
4 1/8" 12 21.26mm(0.84") 9.5mm(0.37") 6.28mm(0.25")
6“ 25 14.53mm(0.57") 4.76mm(0.19") 1.52mm(0.06")
6.25" 12 18.92mm(0.74") 9.52mm(0.37") 3.81mm(0.15")
6.25" 25 14.54mm(0.57") 4.76mm(0.19") 1.52mm(0.06")
8" 25 25.4mm(1") 6.35mm(0.25") 1.7mm(0.07")

Not recommended, only for dry transfer

PEEK Wafer Cassettes also have customization services enabling it to meet special production needs, as is important in the semiconductor industry where standard products might not completely match equipment interfaces, type of wafers or environmental factors. Structural customization is usually done to adjust the dimensions, slot shapes, material additions, or features to enhance compatibility and efficiency. As an example, wafer diameter (75mm to 300mm) slot widths can be modified, laser engraving, RFID integration and automated inventory control may be implemented or electrostatic dissipative finishing may be used to avoid contamination. Color customization is also possible, it is possible to mix carbon fiber to increase rigidity, and specifications such as widened slots (to thicker wafers) or a coating resistant to chemicals such as Teflon PFA can be added. The customization follows the standards of SEMI, which promote an easy integration into automated devices such as robotic arms and typically the delivery times are 4-8 weeks depending on the complexity. The flexibility is perfect in high-precision processes like CVD or diffusion in high temperature transfers.

 

Customization Category Specific Options Typical Parameters Benefits
Dimensions and Capacity Wafer diameter adjustments (75mm, 100mm, 150mm, 200mm, 300mm); Slot count modifications (12, 22, 25 slots) Slot width: Adjustable 1.5-3mm; Dimensions: Compliant with SEMI M31 standards Accommodates various wafer thicknesses, reduces slippage risk, enhances automation compatibility
Slot Design Widened slots, open/closed slots, optimized bevel angles Slot spacing: 10-15mm; Angle: 5-10° Facilitates wafer insertion/removal, suitable for thick or thin wafers, reduces damage
Material Enhancements Carbon fiber blending, ESD coating (electrostatic dissipative), nanomaterial additives Surface resistivity: 10^6-10^9 Ω/sq; Colors: Black/natural/custom Improves wear resistance and static protection, ideal for cleanroom environments
Additional Features Laser engraving, RFID integration, chemical-resistant coatings (e.g., PFA or PPS) RFID frequency: 13.56MHz; Engraving depth: 0.1-0.5mm Enables tracking and automation, boosts production efficiency
Other Special Requirements Machine interface compatibility, color customization Temperature resistance: Continuous 120°C, peak 340°C Matches specific equipment, enhances overall durability

Attribute PEEK Wafer Cassette PFA Wafer Cassette Advantage Comparison (PEEK vs PFA)
Temperature Resistance Continuous 120°C, peak 340°C Continuous 100°C, peak 260°C PEEK excels in high-temperature processes like CVD and diffusion
Chemical Resistance Good (resists most solvents, not suitable for strong acid immersion) Excellent (fully fluorinated, resists strong acids and bases) PFA outperforms in chemical cleaning processes
Mechanical Strength High rigidity, wear-resistant (tensile strength ~100 MPa) Moderate (tensile strength ~25 MPa) PEEK is more durable, with longer lifespan (twice that of PPS)
Static Protection ESD-safe, carbon fiber blending available Good, but requires additional coating PEEK integrates ESD functionality more easily
Cost Higher (premium applications) Moderate PEEK offers greater value for long-term investment
Typical Applications Dry transfers, high-temperature baking Wet chemical processes PEEK excels in temperature resilience, PFA in chemical compatibility

Certification and advantages of Wafer Cassette made of BW PEEK

In the certification test evaluation, it has passed the banned substance test such as RoHS reach, and also passed the metal ion and surface ion test.
The finished product of the Wafer Cassette made of BW PEEK has a smooth and flat appearance, without obvious patterns and flow marks, Able to do laser engraving, Able to install RFID. Keep track of carrier and material.
Carrier Wafer

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Phone:+86-13868966491

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